Date
Place
- Room H (Room Hall 1, 1F)
- P2. Poster Session II
- August 21, 2015 (Friday)
- 14:00 ~ 15:30
- [P2-87]
- 14:00 ~ 15:30
- Title:Localized Induction Heating for Low Melting Point Alloy and Epoxy Mixture Encapsulation of OLED
- Chuyi Ye and Cheol-Hee Moon (Hoseo Univ., Korea)
Abstract: We?introduce?a?new?way?to?heat?the?LMPA?and?epoxy?mixture?locally.?The?induction?heating?has?the?characteristics?such?as?non-contact,?time?saving?and?selective?heating.?In?this?case,?we?can?proceed?the?sealing?in?a?short?time?without?contacting?or?heating?the?OLED?device.?We?manufacture?the?high?frequency?AC?power?supply?depending?on?the?ZVC-circuit,?whose?frequency?can?reach?250kHz.?We?measure?the?sealing?temperatures?of?the?LMPA?barriers?and?the?OLED?device?area.?It?shows?that?the?LMPA?melts?in?a?short?time?and?the?OLED?device¡¯s?temperature?is?far?behind?the?limited?temperature.?As?a?result,?the?induction?heating?is?convenient,?fast?and?safe?heating?method?and?it?is?a?ideal?for?the?OLED?sealing?with?LMPA.?
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