Date

Place

[P2-44]
14:00 ~ 15:30
Title:Transfer Printing Method for Ag-Ink-Based Conductive Electrode on Flexible Substrate by Utilizing Self-Aligned Polymeric Anchor Structure
Joon-Chan Choi, Ji-sub Park, Min-Kyu Park, Imtiaz Mahmud, and Hak-Rin Kim (Kyungpook Nat'l Univ., Korea)
Abstract: In this paper, we demonstrated a novel method to fabricate a highly conductive electrode using metal ink with transfer printing method to applying an anchor structure. We screen-printed Ag electrode pattern on glass substrate coated polymeric buffer layer using Ag ink. Ag electrode pattern was sintered on the hot plate to increase conductivity. After sintering process, we applied a polymeric buffer layer etching process to reduce the attached area between Ag electrode pattern and polymeric buffer layer for reducing adhesion energy. In our experiment, almost 100 % pick-up yield of Ag electrode pattern was achieved for 5 minutes etching time. To enhance the printing yield, we coated cellulose ether at the bottom of Ag electrode pattern by micro contact printing method and printed on polyethylene terephthalate (PET) substrate. We observed superior bending stability that Ag electrode pattern had not cracks and detachment under the harshly bending stress (Bending radius: 3 cm).
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