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Program

Date
Place
  • Room H (Room Hall 1, 1F)
  • P2. Poster Session II
  • August 21, 2015 (Friday)
  • 14:00 ~ 15:30
  • [P2-33]
  • 14:00 ~ 15:30
  • Title:Fabrication and Characteristic of Wrinkled Stiff Thin Films on Elastomeric Substrates by Oxygen Plasma Treatments
  • Sang Chul?Lim, Myung Chan?An, Dong Ic?Lee, Se Hyuk?Yeom, Gyeong-Tae?Park, Chang Taek?Seo, Gyu Seok?Choi, and Heon Gon?Kim (Gumi Electronics and Information Tech. Research Inst., Korea)

  • Abstract: The PDMS system of choice for the presented process is Sylgard 184(DOW corning) which is usually applied in a 10:1 ratio (w/w) of siloxane and curing agent and requires a thermal curing step. These were treated on one side with oxygen plasma for 5, 10, 15 min to create a nanoscale silica skin, thus presenting identical surface chemistry in all experiments. This paper presents a cost-effective and simple method to form wrinkled stiff SiOx thin films on polydimethylsiloxane (PDMS) substrates at room temperature by oxygen plasma on pre-strained PDMS. The orientation of the generated structures was always perpendicular to the pre-stretched direction and the pitch of the structure could be adjusted ranging from 1.1 ¥ìm to 3 ¥ìm by controlling the strength of the pre-stretched strain and the thickness of the surface metal film. Upon relaxation, highly controlled and regular wrinkling of the silica skin resulted. Bi-layer substrates under uniaxial compression exhibit micron-scale features that can impart mechanical flexibility in functional electronic devices including interconnects, transistors and solar cells.

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