Date

Place

[28-1]
09:00 ~ 09:25
Title:[Invited] Electromechanical Reliability of Metallization on Flexible Substrates
O. Glushko, M.J. Cordill (Erich Schmid Inst. for Materials Science, Austria), A. Klug, and E. J. W. List-Kratochvil (NanoTecCenter Weiz Forschungsgesellschaft mbH, Austria)
Abstract: The main advantages of flexible electronics in comparison to conventional rigid technology are light-weight design, mechanical and topological flexibility as well as large area and cost-effective production. For realization of these advantages within a final device not only development of novel appropriate materials and fabrication methods but also understanding of reliability issues and failure mechanisms are required. In this contribution an overview of basic failure mechanisms which are observed in flexible electronics components under different loading conditions is presented. Using a newly developed bending test apparatus it is shown that even for the same amount of applied cyclic strain, i.e. for the same bending radius, the amount of mechanical damage differs significantly depending on whether tensile, compressive or alternating tensile-compressive strain is applied. A systematic investigation of the relationship between mechanical damage and degradation of electrical conductivity is presented by comparison of metallization layers with different microstructure.
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