Date
Place
- Room F (Room 320)
- 27. Substrates and Optical Films
- August 20, 2015 (Thursday)
- 09:00 ~ 09:55
- [27-3]
- 09:40 ~ 09:55
- Title:Effects of Thermal Cycle on Fracture Strength Weibull Distribution of Carrier Glass Substrate for Flexible OLED
- Kwangjoon Kim and Yongseog Kim (Hongik Univ., Korea)
Abstract: In this study, effects of heat-treating conditions, including peak temperature, heating and cooling rate, on the Weibull distribution of fracture strength of the glass substrate were examined. The peak temperature was 450oC, heating and cooling rate was varied from 5oC/min to 50oC/min in this study. The 4-point bending glass samples were polished prior to the heat treatment in order to minimize the edge defects. Using the samples prepared under such conditions, flexural strength was measured using the 4-point beding test method. 60 samples were tested to evaluate Weibull distribution parameters.The result shows the effects of heat treating conditions on the fracture strength, residual strength, and Weibull modulus. The results indicate that the heating and cooling rates do not influence the average fracture strength of the glass substrate much. The Weibull parameter, which describes the distribution of fracture strength, is increased with the increase in the heating and cooling rate. This results suggest that the heating and cooling rate may need to keep high in order to prevent the premature failure of the substrate during processing of flexible OLED.
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