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Program

Date
Place
  • Room F (Room 320)
  • 27. Substrates and Optical Films
  • August 20, 2015 (Thursday)
  • 09:00 ~ 09:55
  • [27-1]
  • 09:00 ~ 09:25
  • Title:[Invited]  KOLON¡¯s R&D on the Substrates for Flexible Electronics
  • Chung-Seock Kang, Sangmin Song, Hak-Gee Jung, Jeonghan Kim, and Tae Hwan Ahn (KOLON Industries Inc., Korea)

  • Abstract: Flexible electronics have attracted people¡¯s huge interest, mainly due to their unique features such as lightness, thinness, and design freedom. In addition, they can be manufactured through R2R process, which can bring dramatic manufacturing cost-down.1 Flexible displays have been known to be one of the most promising flexible electronics. Samsung has launched ¡°Galaxy Edge¡± using a conventional polyimide as a bottom substrate. Even though it is a bent display, it implies that the real flexible display era would open in near future.2 There are two main components required for achieving flexible displays. They are flexible substrate (bottom and cover window) and flexible TFT. As a material company, KOLON has been concentrating on R&D of the flexible polymeric substrate. We have developed ¡°colorless polyimides (CPI)¡±, which have no color and high thermal stability unlike conventional polyimides.3 They can be used as not only a bottom substrate for flexible transparent display but also a cover window. The first target application of our CPI film is the cover window, which means the replacement of reinforced glass. The characteristic properties of the hard coated CPI film are summarized in the Table 1. We have been also developing CPI solution as a bottom substrate for transparent displays. Its properties are described in Table 2. They imply that our CPI solution is applicable to TFT which process temperature is around 350¡É.

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