The 9th International Meeting on Information Display (IMID 2009), it is great honor and pleasure to invite you to the conference, which will be held at KINTEX, Seoul, Korea during October 12 ~ 16, 2009.
Conference Topic
| 06.Flexible and Future Displays / Electronic Paper |
All aspects of flexible displays and plastic electronics, including advances in organic materials(both small molecules and polymers), printable inorganic semiconductors and devices, electrodes, device structures, physical electronics, fabrication processes, driving methods, characterization and analysis of device performance, transport physics, etc: |
E-papers, Flexible Backplanes; Flexible LCDs; Flexible OLEDs; Flexible Substrates and Barriers; Thin-Film Encapsulation; Electrode and Interconnection; Processes (including patterning and printing); Manufacturing |
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Invited Speakers (Partial List) |
Program Committee Members |
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Ananth Dodabalapur (Univ. of Texas, Austin, USA) Antonio Facchetti (Northwetern Univ., USA) Michael Hack (UDC, USA) Nobukazu Hirai (Sony, Japan) Chang-Dong Kim (LG Display Co., Ltd., Korea) Michael McCreary (E-ink, USA) Nam-Seok Roh (Samsung Electronics Co., Ltd., Korea) |
Chair
Chung Kun Song (Dong-A Univ., Korea)
Secretary Bonwon Koo (SAIT, Korea) Yong-Young Noh (ETRI, Korea)
Member Jong Sun Choi (Hongik Univ., Korea) Michael Hack (UDC, USA) Jeong-In Han (KETI, Korea) MunPyo Hong (Korea Univ., Korea) Yongtaek Hong (Seoul Nat'l Univ., Korea) Bo Sung Kim (Samsung Electronic Co., LTd., Korea) Byung Uk Kim (Dongjin Semichem, Korea) Chang Dong Kim (LG Display Co., Ltd., Korea) Insun Kim (i-components, Korea) Soon-Ki Kwon (Gyeongsang Nat'l Univ., Korea) Michael McCreary (E-ink, USA) Yeon Gon Mo (Samsung Mobile Display, Korea) Nam Seok Noh (Samsung Electronic Co., LTd., Korea) Beng Ong (ASTAR, Sinapore) Takao Someya (Univ. of Tokyo, Japan) |
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Abstract Submission ( by May 26, 2009) |
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We encourage you to submit abstract / summary for IMID 2009 to join us this events and share your expertise with other participants. Please prepare your abstract / summary in MS-Word (doc) format for the submission by May 26, 2009 to the conference website.
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